Tessolve, a global provider of engineering solutions, has announced its partnership with the TSMC Design Center Alliance (DCA) program, part of the TSMC Open Innovation Platform® (OIP). This collaboration will focus on chip implementation and system-level design solutions, leveraging Tessolve’s expertise in IC design, testing, and embedded systems development. With a strong emphasis on TSMC’s industry-leading process technologies, the partnership aims to simplify and accelerate projects for customers in various sectors, including AI, IoT, automotive, and more. Tessolve’s comprehensive services, combined with TSMC’s advanced process technologies, will help reduce barriers and facilitate more efficient semiconductor and electronics designs.
