Realize next-gen chips and systems – on robust engineering
Innovating Possibilities To Products
An extended arm of semiconductor firms
Semiconductors are getting compact by the day. Developing them is getting complex. We’re simplifying complexities while catalyzing the productization of System-on-Chip, supporting faster GTMs without loss of performance and integrity. Almost two decades of engineering expertise empowers us with knowledge, and we’re straightforward in what works and what wouldn’t – driving ideas to the final product actively.
Engineering Solutions
End-to-end – VLSI to Hardware for a first-pass product
Chip Design
Our VLSI design team provides customers with semiconductor engineering solutions from RTL to GDS II. With our digital and analogue expertise combined, we are uniquely positioned to address a variety of chips at advanced process nodes. We know how to take your chip to market by providing strategy along with implementation. We can integrate into your existing team or become an extension of your process. As a value-add, our deep semiconductor testing expertise allows us to plan a DFT strategy that ensures faster silicon bring-up.
Package Engineering
Chip design is only a job half done. We realize in our semiconductor design services that the actual product depends on in-depth packaging and fabrication expertise, using the latest in semiconductor materials technologies at a competitive price point. From the right wafers to the underfill – we leverage the best resources to deliver advanced packaging semiconductor integrations.
Post Silicon
Focus on the developed hardware and supporting software testing, like system-level testing semiconductor and verification, leveraging a proven validation approach besides pre-silicon characterization and qualification competencies. The outcome is a first-pass product with near zero defects within a lesser time frame of semiconductor engineering.
Hardware Design & Manufacturing
Hardware is a critical piece of Chip and Systems development. We as a semiconductor services company address this with 200 PCB designers who can design and develop ATE boards, System boards, and Reliability and Evaluation boards. Our domain expertise includes RF, Mixed Signal, Digital, and Analog boards. We have built the necessary infrastructure required to optimize our HW designs including library development, BOM management, and simulations.
Industries
Continuous investment of technical expertise has enabled us to handhold customers right from the specification stage through the entire product life cycle. Keeping pace with the increasing complexity and rising demands in the semiconductor space, such as semiconductor testing and advanced packaging semiconductor, we have evolved beyond our role as an engineering services provider.
Expertise In A Nutshell
Mastery of diverse signals and ATE platforms
End-to-end semiconductor solution development – from chip design, test, and PCB engineering through post-silicon support.
Faster time-to-market through deep domain expertise in Analog, Digital, Mixed Signal, and RF.
Broad ATE platform experience and built-in infrastructure including a test floor, characterization, reliability lab, and PCB FAB.
The ability for clients to leverage high-end semiconductor engineering in a cost-effective model as we scale teams to meet the exact customer needs.
Expertise To Outcomes
Leading good ideas to great products
Expertise In A Nutshell
Mastery of diverse signals and ATE platforms
End-to-end semiconductor solution development – from chip design, test, and PCB engineering through post-silicon support.
Faster time-to-market through deep domain expertise in Analog, Digital, Mixed Signal, and RF.
Broad ATE platform experience and built-in infrastructure including a test floor, characterization, reliability lab, and PCB FAB.
The ability for clients to leverage high-end semiconductor engineering in a cost-effective model as we scale teams to meet the exact customer needs.
Expertise To Outcomes
Leading good ideas to great products
Experience Tessolve’s Innovating Engineering Excellence
A leading semiconductor company in the USA, Tessolve is dedicated to pushing the boundaries of innovation. With a commitment to engineering excellence, we deliver cutting-edge solutions across diverse sectors. Our customer-centric approach ensures tailored solutions that exceed expectations, fostering long-lasting partnerships globally. Join us on the journey to unlock the full potential of technology with Tessolve.
A leading semiconductor company in the USA, Tessolve is dedicated to pushing the boundaries of innovation. With a commitment to engineering excellence, we deliver cutting-edge solutions across diverse sectors. Our customer-centric approach ensures tailored solutions that exceed expectations, fostering long-lasting partnerships globally. Join us on the journey to unlock the full potential of technology with Tessolve. A leading semiconductor company in the USA, Tessolve is dedicated to pushing the boundaries of innovation. With a commitment to engineering excellence, we deliver cutting-edge solutions across diverse sectors. Our customer-centric approach ensures tailored solutions that exceed expectations, fostering long-lasting partnerships globally. Join us on the journey to unlock the full potential of technology with Tessolve.
Let's Realize Today's Products On Tomorrow's Expertise
