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Tessolve and NXP

Delivering High-Quality Semiconductor Design and Engineering Services

Partnership Overview

About the program and our offerings

About Connect Partner Program

NXP’s Connect Partner Program is a global network of independent engineering solution companies to speed up Client’s design.

What We Are Offering

As an NXP program partner, we product engineering services & solutions including design, development, regulatory qualifications, manufacturing, and post-manufacturing product life cycle support.

Our Differentiator

In-house developed a family of systems on modules “MAGIK-2” based on SMARC & Q7 standard using I.MX6 and I.MX8 processor offering Linux & Android software SDK, backed with our own EVK boards which help customers accelerate the product development cycle.

Focus On Hardware

Embedded board solutions for the NXP Program

Cross-Industry-icn

i.MX8 SMARC SOM

i.MX8M SMARC SOM Using the SMARC standard 2.0 for embedded modules, supporting Linux & Android SDK with BSP.

Cross-Industry-icn

i.MX6 SOM Boards

i.MX6 SMARC & Q7 SOM boards supporting Linux & Android SDK with BSP, Middleware & UI (Qt/Android) support.

Cross-Industry-icn

S32G2 SMARC SOM

Tessolve introduces a SMARC 2.1 SoM (System-on-Module) based on S32G2 CPU a high-performance vehicle network processor.

More On The Modules Here

Download Datasheets

NXP Evaluation Board

NXP S32G2 SMARC SoM

M2-SM6-xx – i.MX6 based SMARC Modules

M2-SM8M-xx – i.MX8M based SMARC Module

M2-Q7M6-xx – i.MX6 based QSeven Modules

Bring Your Ideas As We Enable Their Realization And Your Leadership

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