Tessolve, a leading global provider of semiconductor engineering solutions, announced today it has joined Intel Foundry Services (IFS) Accelerator Design Services Alliance to enhance post-silicon validation for complex digital, analog, and mixed-signal ASICs. This collaboration aims to expedite time-to-market for IFS customers through a comprehensive suite of cutting-edge Test Development and Execution services, spanning from Post Silicon bring-up to NPI. Tessolve’s expertise in Package design, ATE programs, Test Hardware, and more will complement IFS’s capabilities, catering to diverse industries like automotive, industrial/IoT, data center/enterprise, and consumer applications. This close collaboration is expected to drive innovation in the semiconductor industry and propel customer value.
