Tessolve proudly celebrates its PCB Design Team for winning the prestigious Siemens Xcelerator Technology Innovation Award in the Best Overall Design category. This recognition highlights their dedication, innovation, and exceptional...
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Tessolve has been recognized in the 2024 Semiconductor Engineering Services PEAK Matrix® Assessment by Everest Group, securing a top position within the Major Contenders bracket in our first appearance. This...
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We’re excited to announce that Tessolve is acquiring Germany’s Dream Chip Technologies! This move strengthens our expertise in advanced chip design across AI, automotive, and data center markets while expanding...
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We are excited to welcome Girish Wagle as Tessolve's new Senior Vice President of Embedded Sales and Business Development. With over 25 years of experience across industries like Telecom, Automotive,...
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Tessolve, a global leader in engineering services and solutions with over 3000 employees, has once again earned the prestigious “Great Place to Work” certification by Great Place to Work, India....
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Tessolve’s Co-founder & CEO, Srini Chinamilli, shares his insights with People Matters, highlighting the crucial role of hard work, ambition, and continuous learning in driving entrepreneurial success. In the article, he discusses how...
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Our CEO, Srini Chinamilli, shared insights on Tessolve’s advancements in AI chip development and our contributions to India’s semiconductor ecosystem in Digit’s feature. The article highlights our end-to-end chip design...
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Tessolve is proud to announce that we have received the esteemed FS ISO 26262 certification, awarded by TÜV SÜD. This recognition underscores our unwavering commitment to quality and safety in...
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Tessolve has inaugurated a new office in Hubli, Karnataka, marking our third expansion in the region. We extend our gratitude to everyone who supported us and thank Sri Sharath Kumar...
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In this exclusive interview with BISInfotech, Tessolve’s CFO, Raghavendra Jha, shares insights into the company's impressive growth, strategic investments, and commitment to engineering excellence. Learn how Tessolve reached the ₹1000...
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We are excited to announce a strategic collaboration with SigmaSense to develop an innovative DSP-based sensing ASIC. This advanced mixed signal ASIC features a low-power touch-sense controller chip integrated with...
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We are thrilled to highlight insights from our CFO, Raghavendra Jha, featured in CFO India’s article, "Mapping the Path of Innovation." In this article, Raghavendra emphasizes the strategic focus needed...
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Tessolve is excited to announce surpassing ₹1000 Crore in revenue, a testament to our team's dedication and the trust of our valued customers and partners. We look forward to continued...
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Economics Times recently highlighted Tessolve's significant contributions to addressing the talent shortage in the semiconductor industry. We're proud to lead initiatives such as conducting specialized workshops, expanding campus hiring, and...
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Tessolve, a Bengaluru-based chip design and testing company, achieved double-digit growth in 2023 despite a 10% industry decline, driven by a 25% CAGR over the past five years and increasing...
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Srini Chinamilli, Co-founder & CEO of Tessolve, recently discussed the company's strategic initiatives with ET Telecom. He highlighted Tessolve's commitment to accelerating plans in India through collaborative discussions with leading...
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Tessolve, a global leader in silicon and systems solutions, has unveiled a SMARC system-on-module (SOM) featuring the Renesas RZ/V2H MPU, tailored for the industrial, robotics, and transportation markets. This collaboration...
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In a recent interview with CIOL, our Co-founder & CEO, Srini Chinamilli, highlighted the pivotal role of semiconductors in shaping tomorrow's tech landscape. he emphasized how semiconductors are fueling innovative...
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Tessolve's Co-founder and CEO, Srini Chinamilli, recently participated in an insightful interview featured on BISINFOTECH, alongside other esteemed industry experts. Delving into the critical domains of semiconductor testing and research...
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Dr. Veerappan VV, the esteemed Co-founder and President of Tessolve, is stepping into the prestigious role of Chairman at the India Electronics and Semiconductor Association (IESA). This transition marks a...
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Tessolve, in collaboration with NXP Semiconductors, has announced the advancement of a mass-market digital connected cluster reference design, leveraging NXP's i.MX RT1170 crossover MCU and other key components. This collaboration...
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Tessolve's CEO, Srini Chinamilli, recently shared invaluable insights with CXOToday, shedding light on Tessolve's journey amidst challenges and opportunities in the semiconductor industry. From design to manufacturing, Chinamilli discusses the...
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Tessolve announces a strategic collaboration with Keysight Technologies to enhance testing capabilities at its newly established HSIO Lab in Bangalore, India. By leveraging Keysight's innovative test solutions and expertise, Tessolve...
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Tessolve, the leading provider of semiconductor engineering solution, joyously commemorates two decades of groundbreaking innovation and unwavering excellence. Over the past 20 years, Tessolve has consistently pushed the boundaries of...
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Tessolve is a leading global engineering service and solution provider, a team of over 3000 skilled professionals is thrilled to announce its recent certification as a "Great Place to Work." ...
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Tessolve is proud to announce its strategic collaboration with Airbiquity, a leading provider of connected vehicle services. This partnership heralds a new era of connected vehicles with Telematics Gateways, Over-The-Air...
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We are very glad to share that our co-founder and CEO, Mr. Srini, has been honored with the prestigious Business Excellence Award by Telugu Times in California. This well-deserved recognition...
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We were excited to participate in the ITC Conference 2023, held on July 23–25, 2023, in Bengaluru, India. International Test Conference India 2023 has been a platform of innovation, collaboration,...
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Tessolve team was excited to participate in the Semicon India event, which was held on 28th to 30th July 2023, in Gandhinagar, Gujarat, India. We had the privilege of connecting...
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Tessolve, a leading global provider of semiconductor engineering solutions, announced today it has joined Intel Foundry Services (IFS) Accelerator Design Services Alliance to enhance post-silicon validation for complex digital, analog,...
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Tessolve, a worldwide provider of engineering solutions spanning complex chip design, semiconductor hardware and software development, testing, failure analysis, and embedded systems development is happy to announce that the Verification Futures...
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Tessolve is a leading semiconductor design services organization that offers comprehensive solutions to its clients, encompassing silicon and silicon platform realization. Tessolve is the world's largest standalone design services provider...
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Tessolve, a global provider of engineering solutions, has announced its partnership with the TSMC Design Center Alliance (DCA) program, part of the TSMC Open Innovation Platform® (OIP). This collaboration will...
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We are thrilled to share another milestone in Tessolve’s journey. For the 1st time, Tessolve has clocked annual revenue of $100M. Despite the ongoing challenge in Semiconductor industry, Tessolve’s growth...
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The Tessolve Vizag team is expanding and is now relocating to a larger facility to accommodate upcoming testing needs. We are glad to announce the inauguration of our Tessolve-Vizag office...
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The Tessolve presence keeps expanding, and we are pleased to announce the inauguration of our Tessolve-Hubballi office on February 10, 2023, at Hubballi, Karnataka. Here is the Press Release from...
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Here is the note from our CEO Srini Chinamilli about the inauguration,- “I am happy to announce that our Austin Semiconductor Test Lab is officially inaugurated. We are looking forward...
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Tessolve is working to enable its first RISC-V based SOC reference design in early 2023, using Intel Pathfinder for RISC-V as the preferred development environment. Tessolve and Intel will implement...
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Tessolve, the semiconductor industry’s leading engineering solution provider, has acquired Pico2Femto Semiconductor (P2fsemi), primarily focused on physical design solutions. P2fsemi’s acquisition significantly strengthens Tessolve’s ASIC design offerings from RTL to...
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Tessolve is proud to announce the successful commissioning of a fully equipped 5th test engineering lab in the heart of Texas at Austin. This is another landmark step to continue...
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We are glad to announce the release of the September 22 edition of our Newsletter, First Bin. The newsletter contains a note from our CEO’s Desk, Tessolve Showcase article, and...
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Among IoT device customers such as organizations, educational institutions and government agencies, there is a lack of industry measures to help to mitigate cybersecurity risks. Read More Find out how...
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A penetration test tells whether the existing defensive measures employed on the system are strong enough to prevent any security break. Read More Understand how T&VS Automotive services help you...
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We are happy to announce part 3 of the IESA Annual Member Meet webinar series, in which Tessolve CEO Mr. P Raja Manickam, will be addressing the opportunities and the...
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Hero Electronix, the parent company of Tessolve, launched another brand under its umbrella last week. The new brand – Qubo – will launch a series of AI-powered intelligent home appliances,…
Using the SMARC standard 2.0 for embedded modules, Tessolve Embedded Systems introduces ultra-low power ARM COMs (Computer-On-Module) based on the Qualcomm SnapdragonSD820 Family which is powered by 64-bit ARMv8-compliant quad-core...
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Tessolve strengthened its work in the field of Near Field Communication (NFC) based on hybrid technology work as the industry transitioned into the new technological world by adding automation process...
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Tessolve kicks off the multi-city, multi-country demonstration of its TERA device, a key next Generation NXP technology (S32G274A based SMARC SoM) based on state-of-the-art Application Gateway at NXP Technology Days...
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Tessolve, a leading semiconductor engineering service partner, was an integral part of the ITC Test Week India 2022, at Radisson Blue Hotel, Bengaluru between July 24-26. The booth highlighted the...
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Tessolve participated at the SemiconIndia 2022, the post-COVID gigantic conference in the Semiconductor industry. The Hon’ble Prime Minister of India, Shri Narendra Modi, inaugurated the conference via Video Conference on...
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Tessolve, a Hero Electronix venture and an end-to-end engineering solution partner for semiconductor and system companies, is pleased to announce the appointment of two industry veterans, Huzefa Cutlerywala as Senior...
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Tessolve announces its inaugural run of its Test Engineering Lab in San Jose on Mar 23. We offer access to test engineering and program development experts and access to testers....
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We are glad to announce the release of the Jan 22 edition of our Newsletter, First Bin. The newsletter contains a note from our CEO’s Desk, Tessolve Showcase article, and...
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Tessolve’s and DynamoEdge have announced a partnership to deliver the fastest end-to-end mobility solutions powered by AT&T 5G. The strategic collaboration of Tessolve with DynamoEdge has paved the way to...
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The partnership will allow showcasing our end-to-end capabilities in supporting Industrial and Automotive OEM’s safety-related Hardware modules, associated Software technology, innovative Automotive product development, and system validation for various customers...
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