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20s Yesrs Success 1

Tessolve Revolutionizes Next-Generation Products with Silicon and Systems Solutions

Productization of next-gen Semiconductor products, from Design to Silicon and Systems, by constant innovation and technical competence. Tessolve unlocks the potential of next-generation semiconductors for our clients. Through seamless design, testing, and embedded system integration, we deliver innovative, cost-optimized solutions and maximize performance that accelerate product launches. With nearly two decades of engineering excellence, Tessolve empowers clients to bring next-generation semiconductors to life.

Where there’s a possibility, there’s a product

Numbers telling our growth story

2004
Till Date - MultipleChips Transformed
3000
Rising Team of
Experts to
900
Test Program
Released
130
PCB Designs Per
Month
35
Products

Between Possibilities And Products

Pillars of expertise become the bridge

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Tessolve roadmap

Embedded within these milestones is our people expertise – technologists, innovators, and thought leaders leading every engagement from a silicon-first perspective.

Industries We’ve Partnered With

Our footprints in their silicon/systems led success

Values Delivered On The Way

People, tech, and transparency to weave a difference

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Our COE programs productize cutting-edge tech – advancing product innovation possibilities
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Uniquely positioned to lead customers from idea to final product on years of silicon engineering and embedded expertise.
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Transparency on what really works, rather than just implementing ensures consistent quality in every product.
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End-to-end Capability to manage the infrastructure – foundry, back-end assembly, and supply chain.

Spectrum Of Offerings

Converging pre-silicon to post-silicon and turnkey expertise

ASIC Design

Innovative semiconductor design services encompassing RTL Design, DV, Emulation, FPGA, Physical design, DFT, etc., with the ability to seamlessly transition from design to development to production. With a strong focus on quality, reliability, and cost-effectiveness, Tessolve delivers cutting-edge ASIC Design solutions for various applications such as AI, IoT, automotive, and more that meet the diverse needs of customers.

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Package Engineering

Expediting package engineering research and design roadmaps while ensuring cost optimizations for clients. Using advanced design tools and methodologies, Tessolve company’s package engineering team helps customers optimize their packaging solutions’ performance, reliability, and cost.

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Post Silicon Support

A comprehensive post-silicon service continuum that includes test engineering, product engineering, and validations, ensuring faster time-to-market. Tessolve services for post-silicon support are designed to help semiconductor companies bring their products to market promptly.

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PCB Design

we specialize in delivering comprehensive PCB solutions, covering schematic design to fully assembled boards. Our expertise extends to advanced silicon hardware engineering, encompassing PCB design, development, and efficient delivery.

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Turnkey
Development

Our end-to-end product design services offer comprehensive solutions encompassing the entire process from concept development to manufacturing, ensuring a seamless and efficient journey for embedded hardware.

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SOM & EVK

Our expertise lies in designing advanced embedded systems, providing smarter, smaller, and more sophisticated solutions. Through our SOM and EVK services, we enable cutting-edge technology development for embedded solutions.

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Embedded Design

Tessolve provides end-to-end product design services in the embedded design solution domain, encompassing the entire journey from concept development to manufacturing.

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The World Of Tessolve

Built on engineering expertise, furthered by innovative minds

Over the past 20+ years, Tessolve has become one of the most trusted companies in semiconductor, chip design, and embedded solutions, made possible through our dedicated people. We are an open hub, allowing Tessolvians to challenge, innovate, and create—VIBE without boundaries.

Our commitment to engineering expertise and innovative thinking has enabled us to stay at the forefront of the industry, providing our clients with cutting-edge solutions that meet their evolving needs. At Tessolve, we are proud of our legacy and excited about the future possibilities.

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Veracity in every
action we plan

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Innovative mindset to
think out of the box

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Bold in taking necessary
tough decisions

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Empathy for all
(peers, partners, clients)

Brands We Helped

Engineering their “Needs” to “Next-gen Solutions”

Our Space Of Updates

A trove of the latest highlights and thought leadership

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Blogs
July 15, 2024

10 Ways Low Power VLSI Design Enables Smarter and Greener Tomorrow

The automotive industry is undergoing a remarkable transformation. Cars are no longer just modes of transportation but have evolved into intelligent machines. A vast range of advanced technologies is driving…
Sidco Event 2024 12 June
Events
June 12, 2024

SIDO 2024

Sept 18th - 19th 2024Tessolve is thrilled to announce its participation in SIDO 2024, a premier event in Lyon, France focusing on the convergence of IoT, AI, and robotics. Scheduled…
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News
July 3, 2024

Tessolve, India’s Leading Semiconductor Engineering Firm, Surpasses ₹1,000 Crore in Revenue

Tessolve is excited to announce surpassing ₹1000 Crore in revenue, a testament to our team's dedication and the trust of our valued customers and partners. We look forward to continued…

Thinking Of A Possibility?
Let’s Ensure There’s A Product

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