Providing Engineering Services
through Innovative Solutions
We Believe
Where there’s a possibility, there’s a product
Productization of next-gen Semiconductor products, from Design to Silicon and Systems, by constant innovation and technical competence. At Tessolve semiconductor, chip designing, and embedded solutions company, we take pride in our ability to seamlessly integrate design, and test engineering processes, embedded systems allowing us to help our customer to bring new products while minimizing costs and maximizing performance. Driven by almost two decades of engineering success, the products are brought to life by the era.
Where there’s a possibility, there’s a product
Numbers telling our growth story
Experts to
Released
Month
Between Possibilities And Products
Pillars of expertise become the bridge
Embedded within these milestones is our people expertise – technologists, innovators, and thought leaders leading every engagement from a silicon-first perspective.
Values Delivered On The Way
People, tech, and transparency to weave a difference
Spectrum Of Offerings
Converging pre-silicon to post-silicon and turnkey expertise
ASIC Design
Innovative semiconductor design services encompassing RTL Design, DV, Emulation, FPGA, Physical design, DFT, etc., with the ability to seamlessly transition from design to development to production. With a strong focus on quality, reliability, and cost-effectiveness, Tessolve delivers cutting-edge ASIC Design solutions for various applications such as AI, IoT, automotive, and more that meet the diverse needs of customers.
Package Engineering
Expediting package engineering research and design roadmaps while ensuring cost optimizations for clients. Using advanced design tools and methodologies, Tessolve company’s package engineering team helps customers optimize their packaging solutions’ performance, reliability, and cost.
Post Silicon Support
A comprehensive post-silicon service continuum that includes test engineering, product engineering, and validations, ensuring faster time-to-market. Tessolve services for post-silicon support are designed to help semiconductor companies bring their products to market promptly.
PCB Design
we specialize in delivering comprehensive PCB solutions, covering schematic design to fully assembled boards. Our expertise extends to advanced silicon hardware engineering, encompassing PCB design, development, and efficient delivery.
Turnkey
Development
Our end-to-end product design services offer comprehensive solutions encompassing the entire process from concept development to manufacturing, ensuring a seamless and efficient journey for embedded hardware.
SOM & EVK
Our expertise lies in designing advanced embedded systems, providing smarter, smaller, and more sophisticated solutions. Through our SOM and EVK services, we enable cutting-edge technology development for embedded solutions.
Embedded Design
Tessolve provides end-to-end product design services in the embedded design solution domain, encompassing the entire journey from concept development to manufacturing.
The World Of Tessolve
Built on engineering expertise, furthered by innovative minds
19+ years since inception, Tessolve company has become one of the most-trusted semiconductor, chip design, and embedded solutions companies, made possible through our people. We are an open hub, allowing Tessolvians to challenge, innovate, and create – VIBE without any boundaries.
Our commitment to engineering expertise and innovative thinking has enabled us to stay at the forefront of the industry and provide our clients with cutting-edge solutions that meet their evolving needs. At Tessolve, we are proud of our legacy and excited about the possibilities of the future.
Veracity in every
action we plan
Innovative mindset to
think out of the box
Bold in taking necessary
tough decisions
Empathy for all
(peers, partners, clients)