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Tessolve Revolutionizes Next-Generation Products with Silicon and Systems Solutions

Productization of next-gen Semiconductor products, from Design to Silicon and Systems, by constant innovation and technical competence. Tessolve unlocks the potential of next-generation semiconductors for our clients. Through seamless design, testing, and embedded system integration, we deliver innovative, cost-optimized solutions and maximize performance that accelerate product launches. With nearly two decades of engineering excellence, Tessolve empowers clients to bring next-generation semiconductors to life.

Where there’s a possibility, there’s a product

Numbers telling our growth story

2004
Till Date - MultipleChips Transformed
3000
Rising Team of
Experts to
900
Test Program
Released
130
PCB Designs Per
Month
40
Products

Between Possibilities And Products

Pillars of expertise become the bridge

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Tessolve roadmap

Embedded within these milestones is our people expertise – technologists, innovators, and thought leaders leading every engagement from a silicon-first perspective.

Industries We’ve Partnered With

Our footprints in their silicon/systems led success

Values Delivered On The Way

People, tech, and transparency to weave a difference

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Our COE programs productize cutting-edge tech – advancing product innovation possibilities
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Uniquely positioned to lead customers from idea to final product on years of silicon engineering and embedded expertise.
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Transparency on what really works, rather than just implementing ensures consistent quality in every product.
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End-to-end Capability to manage the infrastructure – foundry, back-end assembly, and supply chain.

Spectrum Of Offerings

Converging pre-silicon to post-silicon and turnkey expertise

ASIC Design

Innovative semiconductor design services encompassing RTL Design, DV, Emulation, FPGA, Physical design, DFT, etc., with the ability to seamlessly transition from design to development to production. With a strong focus on quality, reliability, and cost-effectiveness, Tessolve delivers cutting-edge ASIC Design solutions for various applications such as AI, IoT, automotive, and more that meet the diverse needs of customers.

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Package Engineering

Expediting package engineering research and design roadmaps while ensuring cost optimizations for clients. Using advanced design tools and methodologies, Tessolve company’s package engineering team helps customers optimize their packaging solutions’ performance, reliability, and cost.

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Post Silicon Support

A comprehensive post-silicon service continuum that includes test engineering, product engineering, and validations, ensuring faster time-to-market. Tessolve services for post-silicon support are designed to help semiconductor companies bring their products to market promptly.

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PCB Design

we specialize in delivering comprehensive PCB solutions, covering schematic design to fully assembled boards. Our expertise extends to advanced silicon hardware engineering, encompassing PCB design, development, and efficient delivery.

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Turnkey
Development

Our end-to-end product design services offer comprehensive solutions encompassing the entire process from concept development to manufacturing, ensuring a seamless and efficient journey for embedded hardware.

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SOM & EVK

Our expertise lies in designing advanced embedded systems, providing smarter, smaller, and more sophisticated solutions. Through our SOM and EVK services, we enable cutting-edge technology development for embedded solutions.

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Embedded Design

Tessolve provides end-to-end product design services in the embedded design solution domain, encompassing the entire journey from concept development to manufacturing.

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The World Of Tessolve

Built on engineering expertise, furthered by innovative minds

Over the past 20+ years, Tessolve has become one of the most trusted companies in semiconductor, chip design, and embedded solutions, made possible through our dedicated people. We are an open hub, allowing Tessolvians to challenge, innovate, and create—VIBE without boundaries.

Our commitment to engineering expertise and innovative thinking has enabled us to stay at the forefront of the industry, providing our clients with cutting-edge solutions that meet their evolving needs. At Tessolve, we are proud of our legacy and excited about the future possibilities.

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Veracity in every
action we plan

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Innovative mindset to
think out of the box

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Bold in taking necessary
tough decisions

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Empathy for all
(peers, partners, clients)

Brands We Helped

Engineering their “Needs” to “Next-gen Solutions”

Our Space Of Updates

A trove of the latest highlights and thought leadership

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Blogs
November 6, 2024

Everything You Need to Know About VLSI Design Cycle

Technological advancement is growing daily, and semiconductor technologies have become an integrated part of human life. However, semiconductors have two aspects: designing and manufacturing (production). Both mentioned above are planned,…
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video
April 24, 2024

Tessolve Semiconductor – Corporate Video

Tessolve is on a journey to realize next-generation products, offering complete turnkey semiconductor and system solutions to shape the future of technology. With two decades of expertise, our team of…
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Events
November 13, 2024

IoT Security Foundation Bangalore Chapter, Bengaluru, India

November 23, 2024Join us for the IoT Security Foundation Bangalore Chapter event focused on "Healthcare at Risk: Securing the Connected Medical Device Ecosystem." This session will explore critical security challenges…
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News
November 14, 2024

Tessolve Recognized in Everest Group’s 2024 Semiconductor Engineering Services PEAK Matrix® Assessment

Tessolve has been recognized in the 2024 Semiconductor Engineering Services PEAK Matrix® Assessment by Everest Group, securing a top position within the Major Contenders bracket in our first appearance. This…

Thinking Of A Possibility?
Let’s Ensure There’s A Product

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