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News/Press Releases

Tessolve raises $40 million from Singapore-based PE firm Novo Tellus

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Tessolve, a Hero Electronix venture and an end-to-end engineering solution partner for semiconductor and product companies, announces that leading Singapore based PE firm Novo Tellus Capital Partners has invested $40M in Tessolve.

Tessolve intends to use this additional fund for acquisitions and investments in key areas of growth and expansion of the business. Besides, this investment provides Tessolve a significant opportunity to accelerate the growth of its Chip Design and ASIC engineering capabilities and further strengthen its global footprint.

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Tessolve Semiconductor is now a certified IPC member

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We are proud to announce that Tessolve Semiconductor Pvt. Ltd. is now an IPC member facility. The IPC membership is mainly focused on electronic interconnect industries & brings together the PCB designers, PCB Fabrication, PCB Assembly, Suppliers & OEM’s. And it facilitates members with training, market research, public policy advocacy and extended services.

With the recent membership certification from IPC, the credibility of our PCB design and related competencies has gained a remarkable advantage. This is another step to reaffirm the quality of our PCB Design & Development under Tessolve Offerings.

Tessolve expands its Japanese operations as part of an international expansion plan to capitalize on its VLSI and Embedded business

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Tessolve, a Hero Electronix venture and an end-to-end engineering solution partner for semiconductor and product companies, announces its expansion of Japanese operations indicating its global expansion strategy to drive international revenue growth.

It is almost 5 years since Tessolve has been operational in the Japanese market, one of the high potential global economies. This provides Tessolve an opportunity to expand its business in new territory and focus on VLSI and Embedded business. Besides, Tessolve’s Japanese operations are expected to target various industry markets like Automotive to avionics, consumer electronics to medical and the company’s business operations plans for tomorrow’s customer in 5G, Autonomous driving, Artificial Intelligence, and Virtual Reality.

Recently Tessolve has broadened the Japanese operations through the addition of highly skilled and experienced local Professionals in the progress and execution of business. Hitoshi Eda, Senior Manager, Program Management has joined Tessolve to act as a technical bridge between Japanese customers and the Tessolve engineering team. This expansion strategy will surely help Tessolve to differentiate its service offering and empower its team to engage with clients.

Tessolve Launches Edge Artificial Intelligence (AI) Integrator to build new Intelligent Solution

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Tessolve, a Hero Electronix venture and an end-to-end engineering solution partner for semiconductor and product companies, has announced a new Edge AI Integrator solution to transform customer’s connected products into new smart products and solutions.

The powerful combination of the Tessolve AI integrator and IoT offerings can support customers from various industries such as avionics, automotive, industrial and medical markets to build more intelligent solutions from their data.

Our Edge AI solution is the brain behind the IoT body parts to create new smart products and solutions or enhance existing products & services. 

The new edge AI integrator solution can be tailored to customer’s requirements and thus help organizations to augment innovation capabilities, increase working efficiency, improve cybersecurity, and enhance customer experience.

Tessolve is providing the advanced hardware and software capabilities, and the multi-standard connectivity required in the end-to-end IoT business solutions such as predictive maintenance for Industry 4.0, smart metering, enhanced vision systems & consumer products, asset management, …

If you want to find out more, please contact:

David Mudard

Senior Sales Manager – Embedded Systems
Tel: +33 (0) 428-290-800
Mobile: +33 (0) 637-303-732
Email: david.mudard@tessolve.com

Tessolve Digitizes the Complete Operations for Kaapi Machines

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We are pleased to announce that the Tessolve Embedded team has Collaborated with Kaapi machines in successfully enabling IOT integration of a commercial coffee vending machine.

The scope of the digitization includes secured contactless coffee dispensing; machine onboarding; beverage management; user management and analytics on consumption.

This solution impacts the full ecosystem: end-users have the safety of contactless dispensing; improved cost management and analytics and efficient management of machines for Kaapi.

Tessolve has created an easy-to-use mobile application for end-users, a desktop application for facility managers and suppliers, and an application for installation and machine onboarding. This is completely digitized and integrated with Tessolve’s IoT framework and customized business logic layer for Kaapi

Tessolve digitization offers a ready-to-use IoT framework comprising connectivity, devices, data, dashboard, and AI which can help in quickly digitizing your business for operational excellence through automation.

For more information please contact:

Satyam Trivedi
Director Engineering IoT Embedded Systems
Tel: + 91 80 66995800
Mobile: 9739536984
Email: satyam.trivedi@tessolve.com

Analog Devices Inc. Recognizes Tessolve At Supplier Day Awards 2020

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2020 adds another milestone to Tessolve’s journey with the recognition as the Best in Service and Responsiveness Emerging Supplier Award, supported by its competent engineering team. The accolade was announced at the second edition of the Analog Devices Supplier Day Awards 2020, celebrating the commitments and exemplary performances of ADI partners in established, emerging, and niche categories.

Tessolve was recognized for its outstanding support and contribution to ADI’s success during the past year and bagged the award under the ‘Best in Service and Responsiveness for Emerging as a Niche Supplier’ criteria.

To know more about this prestigious recognition, follow the comments of Steve Lattari, Senior Vice President, ADI Global Operations and Technology, announcing Tessolve as the winner.

Tessolve Joins The STMicroelectronics Partner Program As An Engineering Solution Partner

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Tessolve has forged another significant partnership leveraging its advanced engineering capabilities and end-to-end product design services in the embedded domain. Recently, we were recognized as an Engineering Solution Partner by STMicroelectronics – a leading semiconductor manufacturer delivering energy-efficient products.

Joining the robust partner program of STMicroelectronics, Tessolve is now listed as a partner and has been featured on its dedicated partner page. The company is poised to provide Hardware/Software/System services and solutions (based on processors, mems, sensors, applications, etc.), furthering the capabilities of original equipment design, manufacturing, and qualification.

Our Founding Members Embark Into New Journeys At Tessolve

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Tessolve steps into a new era as senior leaders begin their elevated journeys, guiding the now and the next steps of the company. We’re proud to announce that our Co-founder and President, Mr. Srinivas Chinamilli, has stepped into the role of Chief Executive Officer (CEO), since October 1st. This allows us to congratulate and celebrate the new journey of Mr. P. Rajamanickam, as he takes over Tessolve as Executive Vice Chairman.
The official announcement of these transitions was made by Tessolve’s parent group – Hero Electronix, early this week. To follow the update and the complete Press Release,

visit: https://m.economictimes.com/industry/cons-products/electronics/hero-electronixs-tessolve-elevates-co-founder-srinivas-chinamilli-as-ceo/articleshow/79015014.cms

CoE Under The Spotlight System Level Test (SLT) for Volume

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Tessolve is the market leader in providing engineering solutions for silicon and systems development. Tessolve has taken a further step to establish Centres of Excellence (COE) in the various areas of Test Engineering, VLSI Analog, VLSI Digital, Embedded Systems, Special Projects, and PCB for large scale adoption of newer technologies and innovations. We have been thinking ahead to establish and empower COE, invest in future competencies to leapfrog the competition, identify solutions for complex business problems and develop new areas for growth. This differentiates Tessolve with the other companies that are focused on the narrow offerings.

System Level Test (SLT) for Volume – SLT for Volume is one of the COE that Tessolve had taken in the Test Business Unit (BU). With the help of our deep experience in Chip level Volume test and Systems Level Validation across various type of market segment ( Consumer, Medical, Automotive, Avionics) and Various type of Devices (Digital, PMIC, Mixed-Signal, RF, and SOC) Tessolve had developed a Proof of Concept for a complex IMX6 Processor SLT that can run Use Case Test on a volume using a commercial Handler. This initiative involves cross BU collaboration which includes Test BU, Embedded BU, PCB/ Hardware Engineering & Mechanical engineering teams.

Examples of Solutions Developed by Tessolve for System Level Test for Volume.

Stay tuned for more updates and videos on SLT!

Tessolve gets accredited by National Accreditation Board for Testing and Calibration Laboratories for competence in Testing

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The credibility of our Reliability Lab has covered a significant mileage with the recent National Accreditation Board for Testing and Calibration Laboratories (NABL) accreditation. A formal recognition of the lab’s technical competence, this is another step for customers to trust and find reliable testing, under the Tessolve roof.

The accreditation by NABL, a Constituent Board of Quality Council of India, comes after assessing the Reliability Lab as per the ISO/IEC 17025:2017 standard. Almost a year-long process, the assessment was also a learning point to enhance our Technical Documentation and Process competency.

To know more about the Reliability Lab and our recognized testing practices, please visit – http://tessolve.com/test-engineering/

Tessolve announced as an In-Kind Partner of Silicon Catalyst

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Our journey to becoming the foundation of new innovations in silicon engineering crosses another milestone, with Tessolve announced as an In-Kind Partner (IKP) of Silicon Catalyst. The global silicon solutions incubator announced the partnership last week with Tessolve and 3 other companies inducted to the IKP family.

As a partner, Tessolve will play a critical role, supporting semiconductor start-ups and emerging hardware companies, leveraging its capabilities in the pre and post silicon design, development, testing, and embedded solutions. The Portfolio Companies of Silicon Catalyst will have access to Tessolve’s wide range of services and diverse expertise.

To know more about the partnership and about Silicon Catalyst, follow the complete coverage of the announcement at – https://siliconcatalyst.com/silicon-catalyst-expands-ecosystem-with-4-additional-inkind-partners

Build a remote testing capability

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T&VS and Tessolve delivered a webinar on the 23rd April 2020, the topic on Dockerize your testing to enable virtual environments.

We demonstrated best practice on how to Dockerize your testing including test automation and code coverage tools, walking you through our approach and experiences.

Here’s what you can learn from the webinar:

  • Benefits of Dockerizing your testing
  • QA best practice in using Docker environments
  • Tips in creating your virtual Docker containers
  • How to integrate SonarQube for code coverage
  • Understand Docker driven test automation
  • Webinar Presentation

    Docker Container

    About Test and Verification Solutions (T&VS)

    Test and Verification Solutions (T&VS) was formed in the UK in 2008 to provide specialist test and verification services and products to the worldwide semiconductor and embedded systems industries. T&VS is able to deliver start-of-the-art solutions by keeping abreast of latest developments through attending, speaking at and organizing industry conferences and events, and by writing leading edge articles on test and verification methodologies and tools.

    Test and Verification Solutions is a privately held Semiconductor & Systems design firm that brings significant expertise and capabilities in the front-end design activities for Digital IC design. More specifically the T&VS team specializes in Design Verification methodologies, in addition to DV, T&VS has good capability in RTL, DFT and embedded software development projects as well.

    About Tessolve

    Simplifiers of silicon engineering

    Technological innovation has accelerated at an unprecedented pace in the recent years and so have the disruptions in the sector of Silicon engineering – complex IC development, increasing failures, inadequate facilities for design, development and testing. At Tessolve, we address these disruptions, helping Semiconductor product companies in Semiconductor IC Design, Test & Product Engineering, PCB Design, Failure Analysis and Systems design. An enabler of smooth design and productization of chips, we leverage our in-house infrastructure, quality excellence practices and cost-effective approaches to bring value-driven solutions and services.

    Find Out More

    Contact one of our consultants today to discuss your requirements.
    No hard sales, just pertinent questions to understand your needs and to discuss how we may be able to help.

    GET IN TOUCH

    Verification of AI Designs

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    DVClub Europe Meeting – April 2020

    Event at a Glance

    Tuesday 21st April, 2020
    12:00 – 13:20 BST
    FREE to attend Online

    Verification of AI Designs

    With the proliferation of IP and SoCs targeted at the fast growing AI (Artificial Intelligence) market, this event will focus on how such designs can be verified

    TimeSession DescriptionSlidesVideos
    12.00Welcome and Introduction
    Mike Bartley, Senior Vice President – VLSI Design, T&VS
    12.05AI chips must get the math right
    Sergio Marchese, Technical Marketing Manager, OneSpin Solutions
    DownloadView
    12.55An Emulation Strategy for Artificial Intelligence Designs
    Gabriele Pulini, Product Marketing Manager, Mentor a Siemens Business
    DownloadView
    12.30ML Verification Turns Convention on its Head
    Adnan Hamid, CEO/CTO, Breker Verification Systems
    DownloadView
    13.20Close

    About DVClub

    The principal goal of each DVCLUB meeting is to have fun while helping build the European verification community through regular educational and networking events. Attendance at DVClub Europe meetings is free and is open to all non-service provider semiconductor professionals. Each meeting addresses a specific issue faced by the design and verification community and whatever your speciality provides an excellent opportunity for updating knowledge as well as share experiences, insights and issues with other members of the verification community.

    Sponsors

    DVCLUB Europe is made possible through the generosity of our sponsors.

    Tessolve Ready To Step Up As A Capable Semiconductor Supplier In Asia

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    Recent years have seen a growing demand for a robust semiconductor supply chain in Asia. The challenges thrown by Novel Corona Virus Disease has further disrupted the region’s supply, and the need of the hour is a capable partner.

    With a diversified supply chain, Tessolve is more than ready to take the mantle of being an alternate supplier in the region. Our engineers are committed and capable to meet the rising demands, empowered by our robust Printed Circuit Board (PCB) Fabrication unit, in Johor Bahru (JB), Malaysia. With key features such as single to 30-layer fabrication, certified quick turn sample to production, and better failure/risk analysis & DFM, the Fab offers a wide range of PCB manufacturing and assembly services.

    In these turbulent times, technology can be a pivotal force to tackle COVD19, and we’re ready to support as the region’s capable semiconductor supplier. For any queries, we request you reach out at sales@tessolve.com and discuss the next steps with our experts.

    Tessolve strengthens its VLSI Design services with the acquisition of T&VS

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    Tessolve consolidated its position as a leading multinational engineering solution provider with the acquisition of Test & Verification Solutions (T&VS). Tessolve, a part of the Hero Electronics group will now be in a better position to provide full turnkey VLSI design services from RTL to GDSII. The company is uniquely positioned as the only player who can take a high-level specification to a qualified part, given its traditional strength in Post Silicon services for ATE testing, IC Characterization and reference board/system bring up.

    This acquisition will take our existing best in class VLSI design to next level by bringing in an increased depth to the front end design activities (DV/DFT), in catching design flaws ahead in the cycle, thus reducing expensive re-design costs, and risks. Apart from the depth into VLSI design capabilities, the acquisition also means a faster realization of turnkey products for its customers in the semiconductors and systems segment.

    Test and Verification Solutions is a privately held Semiconductor & Systems design firm that brings significant expertise and capabilities in the front-end design activities for Digital IC design. More specifically the T&VS team specializes in Design Verification methodologies, in addition to DV, T&VS has good capability in RTL, DFT and embedded software development projects as well.

    T&VS is the fourth strategic acquisition by Tessolve in the last 5 years, adding strength to its ability as a provider of a comprehensive spectrum of services under one roof. Post the acquisition, the current management team at T&VS will remain in place and augments Tessolve’s ability to service and expand into two new high potential markets of the UK, Japan, Korea and also other regions in India such as Chennai, Hyderabad and Noida regions.

    To know more about Test and Verification Solutions (T&VS), visit the company’s website – https://www.testandverification.com/

    Tessolve Defines Engineering Success In Design, Test, And Production In Bengaluru Tech Summit 2019

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    Last week, Tessolve participated in the 22nd edition of Bengaluru Tech Summit 2019, organized by the Dept. of IT & BT, Government of Karnataka. The summit, held at the Bengaluru Palace from 18th Nov till 22nd Nov, was inaugurated by honorable Karnataka Chief Minister – B. S. Yediyurappa. With a focus on breakthrough innovations in AI, Cyber- Security, Space and Drone Revolutions, Electric Vehicles, 5G, Genomics, and Agricultural Evolution, the event brought together industry experts and innovative startups.

    At the event, Tessolve highlighted the story of defining engineering success end to end through Design Test & Production. Meaningful conversations, engaging demo on embedded products, key infographics that spoke about precision engineering and testing, were highlights at the booth. The outcome was a continuous footfall of visitors from various organizations belonging to different industries. Especially there were visitors from IT and Startups to learn more about Tessolve, and its role in the latest technologies. The event ended with a high note with discussions on companies exploring possibilities to collaborate.

    Tessolve Showcases Future-Ready Engineering Designs At The Qualcomm Information Forum 2019

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    Tessolve participated at the Qualcomm Information Forum 2019, reinforcing its commitment to engineering new possibilities for Qualcomm.

    The event, held at Whitefield, Bengaluru on 17th October 2019, was the platform where Qualcomm re-iterated its focus on 5G Technologies and its reach beyond the mobile industry. At the event, industry experts from Qualcomm also talked about use cases in Automotive, Industrial Manufacturing, Smart Cities, IoT, AI, and AR/VR in gaming and eCommerce.

    Tessolve – a Qualcomm licensee, demonstrated several designs enabled on Qualcomm Snapdragon processors. Also, several modules engineered for IoT and Industry 4.0 space, were on display at the event. Besides this, experts from the team led the audience through a demo of SD210 based Car Infotainment System, generating interest amongst the listeners.

    India Mobile Congress

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    Tessolve Highlights Its Product Engineering At The India Mobile Congress 2019 With Qualcomm And Hero Electronix

    Tessolve participated at the India Mobile Congress 2019 along with its parent company – The Hero Group. The event, organized at Aerocity, New Delhi, between 14th to 16th October, hosted Tessolve and the brand Qubo (a product line of Home Automation), owned by Hero Electronix, with both companies having their booths – side by side.

    Partnering with Qualcomm, the embedded team participating at the event demonstrated Tessolve’s Product Service Engineering and IoT offerings on Industrial, Connected Cars, Smart Lighting, IoT Bricks-Sensors and Connectivity Modules and Gateway. With the event focused on 5G, the team had significant tractions at the booth with companies and consumers engaging about IoT Gateway, Modules, and Connected Car Offerings.

    Tessolve Proudly Announces The Launch Of ‘Qubo’ By It’s Parent Company Hero Electronix

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    Hero Electronix, the parent company of Tessolve, launched another brand under its umbrella last week. The new brand – Qubo – will launch a series of AI-powered intelligent home appliances, catering to the country’s smart home ecosystem.

    Under this umbrella, the flagship product of the company is the Qubo Smart Indoor Camera. A device powered by advanced sensor technology and has Amazon’s Alexa built-in, enabling users to access a host of services.

    To know more about Qubo and this launch and further plans of Hero Electronix, read the complete press release here –
    https://gadgets.ndtv.com/smart-home/news/qubo-smart-indoor-camera-price-in-india-rs-13490-launch-hero-electronix-september-27-2102453
    To know more about Qubo please visit,
    https://www.quboworld.com

    Tessolvians Celebrated Their 15th Anniversary With A Special Lunch Hosted By The Leadership

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    Commemorating the 15th year of Tessolve, the Tessolvians at the Bangalore, Electronic City office, gathered for a special lunch, on August 29. Hosted by Tessolve senior leadership, the lunch was a congratulatory token for the persistence and efforts of employees in the Tessolve journey since 2004.

    On the afternoon of August 29, employees across the various departments gathered at the Tower 2 cafeteria. The teams were greeted by the assemblage of the senior leadership of our CEO Mr. Raja Manickam, Co-Founder & President – Mr. Srinivas Chinamilli, VP of Operations – Mr. D. Rajakumar and others. Besides presenting lunch to everyone gathered, they also recognized employees at the event for their praiseworthy efforts.

    Everyone had an amazing time with lunch and candid discussions while the DJ played some amazing background scores to lift the ambiance. The lunch, a mark of the solidarity at Tessolve, was a reflection of the ownership and oneness people felt with the company, with people at Outer Ring Road office and customer locations also joining the celebration.