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Test & Product Engineering

Test & Product Engineering

Tessolve provide Test & Product engineering Solutions & services from simple Logic ICs, high-speed digital, RF, Analog, PMIC, Mixed-signal, MCU/MPU, MEMS, Image Sensors, Memory to complex devices like ASIC/ASSP, SoC / SiP devices that go into Automotive, IoT, Wearable, Wireless, Computing, Network / Fiber optics and other consumer markets. We also engage ourselves in providing test solutions for emerging technologies in the 2.5D / 3D space.

Tessolve offers best-in-class test and product engineering services to semiconductor companies not only for the ‘Time to market’ stage - (viz. preliminary R & D stages of your product development cycle all the way to final stages of successful tape out), but also across the ‘Time in market’ stages like the NPI, Growth phase, Maturity and Product Decline/extension phases.

Engaging our Test consultants across various stages of your product life cycle ensures best-in-class test & product services.Through our technical excellence and operational expertise, ease your burden, reduce time and cost and improve overall productivity.

Tessolve is the only independent company with over 600+ dedicated test engineering resources offering total solutions for IC test & product engineering.

Our test floor is versatile, enhanced continuously with adaptation of new test technology. Tessolve has invested in a mix of Automatic Test Equipment (ATE) and supporting equipment to meet the growing complexity in device test requirements.

Tessolve works with all ATE platforms thereby ensuring Customer objective of lowest cost of test and maximum test coverage, which are met by choosing the most optimal test systems. Our independence from sub-cons permits us to transfer ownership of all IP and hardware to you, the end customer, giving you the freedom to choose the most optimal and best performing sub-con for production ramp up.

Test & Product Engineering

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