Copyrights © Tessolve Semiconductor Pvt. Ltd. All rights reserved.
Design by Webindia
Tessolve provide Test & Product engineering Solutions & services from simple Logic ICs, high-speed digital, RF, Analog, PMIC, Mixed-signal, MCU/MPU, MEMS, Image Sensors, Memory to complex devices like ASIC/ASSP, SoC / SiP devices that go into Automotive, IoT, Wearable, Wireless, Computing, Network / Fiber optics and other consumer markets. We also engage ourselves in providing test solutions for emerging technologies in the 2.5D / 3D space.
Tessolve offers best-in-class test and product engineering services to semiconductor companies not only for the ‘Time to market’ stage - (viz. preliminary R & D stages of your product development cycle all the way to final stages of successful tape out), but also across the ‘Time in market’ stages like the NPI, Growth phase, Maturity and Product Decline/extension phases.
Engaging our Test consultants across various stages of your product life cycle ensures best-in-class test & product services.Through our technical excellence and operational expertise, ease your burden, reduce time and cost and improve overall productivity.
Tessolve is the only independent company with over 600+ dedicated test engineering resources offering total solutions for IC test & product engineering.
Our test floor is versatile, enhanced continuously with adaptation of new test technology. Tessolve has invested in a mix of Automatic Test Equipment (ATE) and supporting equipment to meet the growing complexity in device test requirements.
Tessolve works with all ATE platforms thereby ensuring Customer objective of lowest cost of test and maximum test coverage, which are met by choosing the most optimal test systems. Our independence from sub-cons permits us to transfer ownership of all IP and hardware to you, the end customer, giving you the freedom to choose the most optimal and best performing sub-con for production ramp up.
Tessolve’s large pool of 400 plus Test & Product engineers with experience on various ATE platforms does not limit the quality services to NPI and R & D stages of Product development, but also to the “Time in market” phase of the product..
Our extensive association with our valued customers has allowed us to develop a deep base of knowledge and expertise in providing engineering solution to simple & complex semiconductor devices packaged in 2.5D/3D packages, SoC, SiP, covering..
With Test floor spreading over 3,000 sq. feet with multiple ATEs, Handlers, Probers and Thermostream and 2000 sq ft of Semiconductor Bench characterization Lab Tessolve has been continuously investing on Test infrastructure