+1 408-865-0873
Test & Product Engineering - Expertise

Expertise

Tessolve specializes in providing engineering solution to simple & complex semiconductor devices packaged in 2.5D/3D packages, SoC, SiP, covering General purpose application to High Performance ASIC and ASSP devices in the Analog, Digital, RF, Mixed signal space.

Our extensive association with our valued customers has allowed us to develop a deep base of knowledge and expertise in performing various Test engineering services like, Test Development and PVT characterization for NPI, Platform Conversion, Multisite development, Test time reduction, Yield analysis et al., for but not limited to,

RF, Telecommunication & Networking:

Digital:

Sensors:

Mixed signal:

Analog:

We also have expertise in controlling / programming via the following interfaces for the various digital / SOC products.

Gigabit Ethernet I2C MIPI CSI (Camera Serial Interface)
DPHY, MPHY Hi-speed ADC standards (JESD) NFC UART
WLAN SATA (till Gen3) SDCDC (SD Card) Display Port EBI Nand
QSGMII RGMII SGMII HSU
SWI SMB GPIB Sound Wire
SPMI USB (Upto V3.0) HDMI DDR (till DDR3)
PCIe (Gen1 & 2) SPAUI XAUI RS485
SVID (3 wire serial digital interface used in PMICs) SWD (Serial Wire Debug used in low pin count MCUs) JTAG SPI
SENT PSI5 TIC (Test Interface controller) for ARM processors  

Test & Product Engineering

Quick Links