A Message From Our CEO-Raja Manickam
We are seeing a revolution in our life style through the increase in mobility, in social networking, individual choices, productivity, and even in governance. While a lot of this can be attributed to the internet and software, the fundamental building block is semiconductors. The revolution in processing speed, power, and miniaturizing in semiconductors has changed how products are used, infrastructure is built, and enable individual choices. All of this can occur with an economy of scale.
Tessolve is part of the semiconductor eco-system that offers engineering services and engineering intensive manufacturing. While there have been significant advances in wafer fab processes, post wafer processing in packaging and test has not kept up with the pace. Tessolve over the years, has built up an expertise in test engineering, test hardware services, and package design. Tessolve enables more new product introductions at a lower cost and continuously looks to reduce cost and cycle time in assembly and test manufacturing. All of the above can be done with the customer, focusing on new products and new markets with shorter time to production.
We believe semiconductor backend operations are moving towards the next phase of innovation with SiP and WLP which is leading to miniaturization and an increase in powerful mobile products. This requires backend companies to have the knowledge and expertise to innovate. We see a future for smart manufacturing companies with intensive engineering capabilities.