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Failure Analysis & Reliability Lab - Decapsulation

Decapsulation

Decapsulation is a necessary step in the Physical Failure Analysis or modification of packaged devices. Decap is performed by using acids or mixtures of acids, at elevated temperatures. A successful Decap will expose the integrated circuit while maintaining the electrical connections to the pins, allowing for FIB circuit editing, photon emission, liquid crystal or other Failure Analysis process to be completed.

Package Type:
DIP, SOIC, PDIP, BGA, SOP, TSSOP, QFN, MEMS, Multi DIE, Stack DIE etc.

  • Selective Area Decapping
  • Polyamide Removal

Bond Wire integrity after decapsulation

Failure Analysis & Reliability Lab

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