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IC Design Engineering - IC Packaging - Services

IC Packaging - Services

Tessolve IC packaging team comprises of energetic individuals with rich progressive experience. Tessolve offers services in package designs such as Flip Chip Packages, Wire Bond Packages, Chip Scale Packages, Multi – Chip modules (MCMs), System in Package (SiP), PoP and MLO/ MLC /L TCC Substrate designs offers end-to-end customer-specific solutions for RF, Analog, High speed and mixed signal products.

Why Tessolve

We provide and support package design starting from all stage of ASIC development. We support Signal integrity and power integrity analysis on electrical interfaces. Chip-Package-PCB co-design for power and signal optimization.

IC Package Services for the following packages

Flip Chip: Sample Design



Wire Bond Sample Design



Package on Package


TCS Substrate Design


Focus Areas

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